The research in this paper extends previous liquid film flow boiling studies by including the effect of an additional electrohydrodynamic (EHD) force, namely the dielectrophoretic (DEP) force. Rather than using only EHD conduction pumping of the liquid film to electro-wet the heater surface, a localized non-uniform electric field above the heater surface is also used to generate a dielectrophoretic force for improved vapor bubble extraction during the nucleate boiling regime. The effect of liquid film height and applied potential are studied as a function of heater superheat and heat flux. The study considers the sole and combined effect of DEP with EHD conduction pumping. A brief analytical study is also used to estimate the expected dielectrophoretic force magnitude and explain the results. All of the above studies are also used to quantify the enhancement in heat transfer that can be achieved when heat transport systems are driven or augmented by these electrohydrodynamic phenomena. The results show remarkable enhancement of up to 1217% in heat flux and boiling heat transfer coefficient for a given superheat when both mechanisms are used simultaneously. The experimental data are important for applications in thermal management in terrestrial and micro-gravity conditions.
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ASME 2015 International Mechanical Engineering Congress and Exposition
November 13–19, 2015
Houston, Texas, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5746-5
PROCEEDINGS PAPER
Combined Electrohydrodynamic Conduction Pumping and Dielectrophoresis for Enhancement of Liquid Film Flow Boiling
Viral K. Patel,
Viral K. Patel
Worcester Polytechnic Institute, Worcester, MA
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Jamal Seyed-Yagoobi
Jamal Seyed-Yagoobi
Worcester Polytechnic Institute, Worcester, MA
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Viral K. Patel
Worcester Polytechnic Institute, Worcester, MA
Jamal Seyed-Yagoobi
Worcester Polytechnic Institute, Worcester, MA
Paper No:
IMECE2015-53247, V07AT09A011; 12 pages
Published Online:
March 7, 2016
Citation
Patel, VK, & Seyed-Yagoobi, J. "Combined Electrohydrodynamic Conduction Pumping and Dielectrophoresis for Enhancement of Liquid Film Flow Boiling." Proceedings of the ASME 2015 International Mechanical Engineering Congress and Exposition. Volume 7A: Fluids Engineering Systems and Technologies. Houston, Texas, USA. November 13–19, 2015. V07AT09A011. ASME. https://doi.org/10.1115/IMECE2015-53247
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