Electrokinetic sheath-flow is one of the techniques used to manipulate sample migration and prevent cross-contamination in multi-channel microfluidic devices. To achieve a successful design, it is important to predict the sample behaviour in advance. We use finite element method to investigate the effect of channel geometry on sample leakage in the presence of electrokinetic sheath-flow. A typical multi-channel device consisting of a main fractionation channel connected to a few collection channels is considered. It has been observed experimentally that the depth of different components of the microfluidic device can change the sample leakage. In-detail investigations are made here in order to find the fundamental cause of the observed behaviour. Simulation results confirmed that by increasing the depth ratio of the collection channels to the main channel the sample leakage would decrease. Simulations are also performed to find criteria for choosing an optimum depth ratio for the channels in terms of both high functionality and ease of fabrication for any specific application.
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ASME 2013 International Mechanical Engineering Congress and Exposition
November 15–21, 2013
San Diego, California, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5639-0
PROCEEDINGS PAPER
The Effect of Geometry on Sample Leakage in Multi-Channel Microfluidic Devices
Elham Rafie Borujeny,
Elham Rafie Borujeny
University of Alberta, Edmonton, AB, Canada
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Zhenghe Xu,
Zhenghe Xu
University of Alberta, Edmonton, AB, Canada
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Neda Nazemifard
Neda Nazemifard
University of Alberta, Edmonton, AB, Canada
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Elham Rafie Borujeny
University of Alberta, Edmonton, AB, Canada
Zhenghe Xu
University of Alberta, Edmonton, AB, Canada
Neda Nazemifard
University of Alberta, Edmonton, AB, Canada
Paper No:
IMECE2013-64079, V010T11A065; 9 pages
Published Online:
April 2, 2014
Citation
Rafie Borujeny, E, Xu, Z, & Nazemifard, N. "The Effect of Geometry on Sample Leakage in Multi-Channel Microfluidic Devices." Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition. Volume 10: Micro- and Nano-Systems Engineering and Packaging. San Diego, California, USA. November 15–21, 2013. V010T11A065. ASME. https://doi.org/10.1115/IMECE2013-64079
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