Numerical analysis to predict the flow behavior of polymers was conducted using commercial finite element software, DEFORM-2D. An alignment structure, a hemisphere-tipped post with an annular ring, was modeled to demonstrate the flow front of the polymer during molding. The cavity filling process was evaluated by measuring the heights of the molded posts and confirmed and validated by experimental data. Estimated and measured heights showed better replication accuracy with the increase of molding temperature and embossing force. Results exposed complete cavity filling at embossing forces of 600 and 900 N at a molding temperature of 137.5°C. The FEM prediction tool can be used to select the adequate process parameters for a high fidelity replication of polymer microstructures.
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ASME 2013 International Mechanical Engineering Congress and Exposition
November 15–21, 2013
San Diego, California, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5639-0
PROCEEDINGS PAPER
Finite Element Analysis for Reliable Replication of Alignment Structures in Micro Hot Embossing
Juan A. Gomez,
Juan A. Gomez
Texas State University, San Marcos, TX
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Glenn Conner,
Glenn Conner
Texas State University, San Marcos, TX
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In-Hyouk Song,
In-Hyouk Song
Texas State University, San Marcos, TX
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Yoo-Jae Kim,
Yoo-Jae Kim
Texas State University, San Marcos, TX
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Byoung Hee You,
Byoung Hee You
Texas State University, San Marcos, TX
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Du-Hwan Chun
Du-Hwan Chun
Yeungnam University, Gyeongsan, Korea
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Juan A. Gomez
Texas State University, San Marcos, TX
Glenn Conner
Texas State University, San Marcos, TX
In-Hyouk Song
Texas State University, San Marcos, TX
Yoo-Jae Kim
Texas State University, San Marcos, TX
Byoung Hee You
Texas State University, San Marcos, TX
Du-Hwan Chun
Yeungnam University, Gyeongsan, Korea
Paper No:
IMECE2013-64829, V010T11A043; 7 pages
Published Online:
April 2, 2014
Citation
Gomez, JA, Conner, G, Song, I, Kim, Y, You, BH, & Chun, D. "Finite Element Analysis for Reliable Replication of Alignment Structures in Micro Hot Embossing." Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition. Volume 10: Micro- and Nano-Systems Engineering and Packaging. San Diego, California, USA. November 15–21, 2013. V010T11A043. ASME. https://doi.org/10.1115/IMECE2013-64829
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