In this paper, we present an investigation of the static behavior of a doubly-clamped microbeam actuated electrically through out-of-plane electrostatic fringing-fields. The distributed electrostatic force is caused by the asymmetry of the fringing-fields. This is actually due to the out-of-plane asymmetry of the beam and its two actuating stationary electrodes. The electric force was approximated by means of fitting the results of two-dimensional numerical solution of the electrostatic problem using Finite-Element Method (FEM). Then, a reduced-order model (ROM) was built using the Galerkin decomposition with linear undamped modes of a clamped-clamped beam as base functions. The ROM equations are solved numerically to get the static response of the considered micro-actuator when actuated by a DC load. Results shows possibility of having three different regimes for this particular MEMS device: a bending regime, a catenary regime, and an elastic regime. Eigenvalue problem is then solved to get the variation of the fundamental natural frequency when the system is deflected by a DC load. Results show that controlling the microbeam stroke, with a DC voltage on the gate electrodes, enables us to tune the system frequency, resulting in a possibility of a tunable MEMS device without a pull-in scenario.
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ASME 2013 International Mechanical Engineering Congress and Exposition
November 15–21, 2013
San Diego, California, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5639-0
PROCEEDINGS PAPER
Structural Behavior of Microbeams Actuated by Out-of-Plane Electrostatic Fringing-Fields
Hassen M. Ouakad
Hassen M. Ouakad
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
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Hassen M. Ouakad
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
Paper No:
IMECE2013-65770, V010T11A014; 7 pages
Published Online:
April 2, 2014
Citation
Ouakad, HM. "Structural Behavior of Microbeams Actuated by Out-of-Plane Electrostatic Fringing-Fields." Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition. Volume 10: Micro- and Nano-Systems Engineering and Packaging. San Diego, California, USA. November 15–21, 2013. V010T11A014. ASME. https://doi.org/10.1115/IMECE2013-65770
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