This paper presents a preliminary study on achieving concurrent spatial mapping of the spatially-varying elasticity of heterogeneous soft materials via a polymer-based microfluidic device. Comprised of a single compliant polymer rectangular microstructure and a set of electrolyte-enabled distributed resistive transducers, this device is capable of detecting continuous distributed loads. Through pressing a specimen against the device by a rigid probe with precisely-controlled displacements, the spatially-varying elasticity of a specimen is captured by continuous distributed loads acting on the device and is further registered as discrete resistance changes at the locations of the transducers in the device. Concurrent spatial mapping is conducted on homogeneous and heterogeneous specimens, and the related data analysis is performed on the measured results to extract their elasticity. The obtained results demonstrate the feasibility of concurrent spatial mapping of the spatially-varying elasticity of heterogeneous soft materials via this polymer-based microfluidic device.
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ASME 2013 International Mechanical Engineering Congress and Exposition
November 15–21, 2013
San Diego, California, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-5639-0
PROCEEDINGS PAPER
Concurrent Spatial Mapping of the Elasticity of Heterogeneous Soft Materials via a Polymer-Based Microfluidic Device: A Preliminary Study
Wenting Gu,
Wenting Gu
Old Dominion University, Norfolk, VA
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Peng Cheng,
Peng Cheng
Old Dominion University, Norfolk, VA
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Zhili Hao
Zhili Hao
Old Dominion University, Norfolk, VA
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Wenting Gu
Old Dominion University, Norfolk, VA
Peng Cheng
Old Dominion University, Norfolk, VA
Zhili Hao
Old Dominion University, Norfolk, VA
Paper No:
IMECE2013-63837, V010T11A004; 9 pages
Published Online:
April 2, 2014
Citation
Gu, W, Cheng, P, & Hao, Z. "Concurrent Spatial Mapping of the Elasticity of Heterogeneous Soft Materials via a Polymer-Based Microfluidic Device: A Preliminary Study." Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition. Volume 10: Micro- and Nano-Systems Engineering and Packaging. San Diego, California, USA. November 15–21, 2013. V010T11A004. ASME. https://doi.org/10.1115/IMECE2013-63837
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