The indentation behavior of metal/ceramic nanolayers is studied, with attention devoted to cyclic response under fixed maximum and minimum indentation loads. The primary objective is to examine the evolving plastic deformation in the ductile metal constrained by the hard ceramic layers. The model consists of alternating aluminum (Al) and silicon carbide (SiC) thin films on a silicon substrate, with the Al/SiC layered structure being indented by a diamond indenter. The rate-dependent viscoplastic response of Al is taken into account in the numerical model. It is shown that plastic deformation in the ductile Al layers continues to occur during the unloading phase of the first cycle, as well as during subsequent reload/unload processes. The cyclic plasticity results in an open load-displacement loop, and the indenter continues to move deeper with each cycle. For the control model of a homogeneous Al film, there is no hysteresis loop and the transient behavior soon approaches stabilization, showing repetitive elastic loading/unloading. The modeling results are also compared with cyclic nanoindentation experiments conducted on the same metal-ceramic multilayer system and control specimen.
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ASME 2012 International Mechanical Engineering Congress and Exposition
November 9–15, 2012
Houston, Texas, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4525-7
PROCEEDINGS PAPER
Analysis of Plastic Deformation in Metal-Ceramic Nanolayers During Cyclic Indentation
C. B. Blada,
C. B. Blada
University of New Mexico, Albuquerque, NM
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Y.-L. Shen
Y.-L. Shen
University of New Mexico, Albuquerque, NM
Search for other works by this author on:
C. B. Blada
University of New Mexico, Albuquerque, NM
Y.-L. Shen
University of New Mexico, Albuquerque, NM
Paper No:
IMECE2012-87751, pp. 863-872; 10 pages
Published Online:
October 8, 2013
Citation
Blada, CB, & Shen, Y. "Analysis of Plastic Deformation in Metal-Ceramic Nanolayers During Cyclic Indentation." Proceedings of the ASME 2012 International Mechanical Engineering Congress and Exposition. Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B. Houston, Texas, USA. November 9–15, 2012. pp. 863-872. ASME. https://doi.org/10.1115/IMECE2012-87751
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