Failure Mechanism and Reliability Design Study of Bendable Electronic Module

An electronic module was designed and developed to bend easily and repeatedly for a mobile application by a low-cost roll-to-roll manufacturing process [1]. The schematic diagram of the bendable module and its numerical model are shown at Fig.1. In the module, a thin silicon electronic chip is embedded in a polymer-based encapsuling adhesive between flexible copper clad polyimide (PI) layers. The thickness of silicon chip is 50 μm. Au bump is attached to the silicon and copper lines with anisotropic conductive film (ACF).