In the world of micro-electromechanical systems (MEMS) R&D efforts are expended creating new means of actuation, usually trading either force or displacement. In our scheme we pump charge into an electrically isolated conductive system with a Scanning Electron Microscope (SEM) to achieve a net force away from the substrate. Though we observe a highly dynamic response, we have approximated the force of the system with a quasi-static mechanical force sensor. The study of this actuation has focused on a spiral spring fabricated in Sandia Ultra-planar Multi-level MEMS Technology (SUMMiT-V™). Experiments show the effect of SEM beam conditions on this device, most notably finding the operation to begin at 5 keV accelerating voltage, where our Monte Carlo simulation predicts the beam will begin penetrating the 0.3 μm thick polySi. The out-of-plane motion has been measured as high as 220 μm which is approximately 2/3 of the diameter of the 2D spiral. A linear elastic model of the force sensor shows that in mechanical equilibrium the deflection is associated with an equivalent uniform pressure up to 90 Pa.
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ASME 2012 International Mechanical Engineering Congress and Exposition
November 9–15, 2012
Houston, Texas, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4525-7
PROCEEDINGS PAPER
Out-of-Plane MEMS Actuation Using a Scanning Electron Microscope
Alexander L. Hogan,
Alexander L. Hogan
University of Utah, Salt Lake City, UT
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Kurtis R. Ford,
Kurtis R. Ford
Sandia National Laboratories, Albuquerque, NM
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Ian R. Harvey
Ian R. Harvey
University of Utah, Salt Lake City, UT
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Alexander L. Hogan
University of Utah, Salt Lake City, UT
Kurtis R. Ford
Sandia National Laboratories, Albuquerque, NM
Ian R. Harvey
University of Utah, Salt Lake City, UT
Paper No:
IMECE2012-88128, pp. 175-185; 11 pages
Published Online:
October 8, 2013
Citation
Hogan, AL, Ford, KR, & Harvey, IR. "Out-of-Plane MEMS Actuation Using a Scanning Electron Microscope." Proceedings of the ASME 2012 International Mechanical Engineering Congress and Exposition. Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B. Houston, Texas, USA. November 9–15, 2012. pp. 175-185. ASME. https://doi.org/10.1115/IMECE2012-88128
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