A common assumption in basic heat exchanger design theory is that fluid is distributed uniformly at the inlet of the exchanger on each fluid side and throughout the core. However in reality, uniform flow distribution is never achieved in a heat exchanger and is referred to as flow maldistribution. Flow maldistribution is generally well understood for the macrochannel system. But it is still unclear whether the assumptions underlying the flow distribution in conventional macrochannel heat exchangers hold good for microchannel system. In this regard, extensive numerical simulations are carried out in a ‘U’ type parallel micro-channel system in order to study flow and heat transfer maldistribution and validated with in-house experimental data. A detailed parametric analysis is carried out to characterize flow maldistribution in a microchannel system and to study the effect of geometrical factors such as number of channels, n, Area of cross section of the channel Ac, manifold cross section area Ap, and flow parameter such as Reynolds number, Re, on the pressure and temperature distribution. In order to minimize the variation in pressure and to reduce temperature hot spots in the microchannel, a Response surface based surrogate approximation (RSA) and a gradient based search algorithm are used to arrive at the best configuration of microchannel cooling system. A three level factorial design involving three parameters namely Ac/Ap, Re, n are considered. The results from the optimization indicate that the case of n = 5, Ac/Ap = 0.12, and Re = 100 is the best possible configuration to alleviate flow maldistribution and hotspot formation in microchannel cooling system.
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ASME 2012 International Mechanical Engineering Congress and Exposition
November 9–15, 2012
Houston, Texas, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4523-3
PROCEEDINGS PAPER
A Numerical Study of Flow and Temperature Maldistribution in a Parallel Microchannel System for Heat Removal in Microelectronic Devices
Manoj Siva, V,
Manoj Siva, V
Indian Institute of Technology Madras, Chennai, India
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Arvind Pattamatta,
Arvind Pattamatta
Indian Institute of Technology Madras, Chennai, India
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Sarit Kumar Das
Sarit Kumar Das
Indian Institute of Technology Madras, Chennai, India
Search for other works by this author on:
Manoj Siva, V
Indian Institute of Technology Madras, Chennai, India
Arvind Pattamatta
Indian Institute of Technology Madras, Chennai, India
Sarit Kumar Das
Indian Institute of Technology Madras, Chennai, India
Paper No:
IMECE2012-87476, pp. 949-958; 10 pages
Published Online:
October 8, 2013
Citation
Siva, M, V, Pattamatta, A, & Das, SK. "A Numerical Study of Flow and Temperature Maldistribution in a Parallel Microchannel System for Heat Removal in Microelectronic Devices." Proceedings of the ASME 2012 International Mechanical Engineering Congress and Exposition. Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D. Houston, Texas, USA. November 9–15, 2012. pp. 949-958. ASME. https://doi.org/10.1115/IMECE2012-87476
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