As a chip mounter demands the high speed and accuracy, the exact reviews of thermal deformations are necessary in these equipments although those are a relatively small. These deformations have a bad influence on the specification of the product or its productivity because the products are manufactured with a micro scale accuracy. The linear motor in chip mounter has an advantage that more comfortably control the linear motion of the motor than the rotary or ball-screw type one. But the linear motor has a disadvantage about thermal problem than the other types. The heat has an effect on the life of the motor and its performance. It causes the mechanical errors by thermal stress and deformation. The heat transfer analysis is complex in chip mounter because of a plate being contacted with the moving linear motor coil on the fixed frame with which the magnetic is attached. For this reason, the trial & error methods have been used for most cases. In this research, we analyzed the thermal stress and deformation of the plate being contacted with the linear motor coil and thermal problems in the equipment using CFD. The reliability of the numerical analysis is verified by being compared with the experimental results. The suggested model is investigated with installing the fans on the upper cover, which confirmed decreased the temperature on the important parts of the equipment.
Skip Nav Destination
ASME 2012 International Mechanical Engineering Congress and Exposition
November 9–15, 2012
Houston, Texas, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4521-9
PROCEEDINGS PAPER
A Study on Cooling Methods to Decrease the Internal Temperature of the Chip Mounter
Dae-hyeon Kim,
Dae-hyeon Kim
Korea University of Technology and Education, Cheonan, Chungnam, Korea
Search for other works by this author on:
Young-nam Lee,
Young-nam Lee
Korea University of Technology and Education, Cheonan, Chungnam, Korea
Search for other works by this author on:
Kwang-Sun Kim,
Kwang-Sun Kim
Korea University of Technology and Education, Cheonan, Chungnam, Korea
Search for other works by this author on:
Hyeon-tae Kyeong
Hyeon-tae Kyeong
Mirae Corporation Ltd., Cheonan, Chungnam, Korea
Search for other works by this author on:
Dae-hyeon Kim
Korea University of Technology and Education, Cheonan, Chungnam, Korea
Young-nam Lee
Korea University of Technology and Education, Cheonan, Chungnam, Korea
Kwang-Sun Kim
Korea University of Technology and Education, Cheonan, Chungnam, Korea
Hyeon-tae Kyeong
Mirae Corporation Ltd., Cheonan, Chungnam, Korea
Paper No:
IMECE2012-87234, pp. 571-577; 7 pages
Published Online:
October 8, 2013
Citation
Kim, D, Lee, Y, Kim, K, & Kyeong, H. "A Study on Cooling Methods to Decrease the Internal Temperature of the Chip Mounter." Proceedings of the ASME 2012 International Mechanical Engineering Congress and Exposition. Volume 5: Education and Globalization; General Topics. Houston, Texas, USA. November 9–15, 2012. pp. 571-577. ASME. https://doi.org/10.1115/IMECE2012-87234
Download citation file:
12
Views
Related Proceedings Papers
Related Articles
High-Fidelity Numerical Analysis of Per-Rev-Type Inlet Distortion Transfer in Multistage Fans—Part I: Simulations With Selected Blade Rows
J. Turbomach (October,2010)
Experimental and Computational Comparisons of Fan-Shaped Film Cooling on a Turbine Vane Surface
J. Turbomach (January,2007)
Natural and Forced Conjugate Heat Transfer in Complex Geometries on Cartesian Adapted Grids
J. Fluids Eng (July,2006)
Related Chapters
Fans and Air Handling Systems
Thermal Management of Telecommunications Equipment
Accuracy of an Axis
Mechanics of Accuracy in Engineering Design of Machines and Robots Volume I: Nominal Functioning and Geometric Accuracy
Outlook
Closed-Cycle Gas Turbines: Operating Experience and Future Potential