Hot spots on a microelectronic package can severely hurt the performance and long-term reliability of the chip. Thermoelectric coolers (TECs) have been shown to potentially provide efficient site-specific on-demand cooling of hot spots in microprocessors. TECs could lengthen the amount of time a processor is capable of running at full speed in the short-term and also provide long-term reliability by creating a more uniform temperature distribution across the chip. We have created a compact model for fast and accurate modeling of the TEC device integrated inside an electronic package. A 1-D compact model for TEC is first built in SPICE and has been validated for steady-state and transient behavior against a finite-volume model. The 1-D model of TEC was then incorporated into compact model of a prototype electronic package and simulations were performed to validate its steady state and transient behavior. This integrated compact model’s results are in good agreement with a finite volume based model developed for TECs integrated inside a package and confirmed the compact model’s ability to accurately model the TEC’s interaction with package. The compact model has relatively small error when compared to the finite-volume based model and obtains results in a fraction of the time, reducing run-time in a transient simulation by 430%. A simple controller was added to the electronic package and TEC model to provide an initial test of how the compact model can aid design of more complex control systems to efficiently operate the thermoelectric coolers.

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