The Analytical Solutions for Heat Transfer in Thin Film Evaporation With Disjoining Pressure

A mathematical model predicting heat transfer and film thickness in thin film region is developed. Utilizing the dimensionless analysis, analytical solutions of the heat flux distribution, the total heat transfer rate per unit width, the location of the maximum heat flux and the ratio of the conduction thermal resistance to the convection thermal resistance in evaporating film region have been obtained. The analytical solutions obtained herein indicate that the maximum dimensionless heat flux is constant which is independent on the superheat. For a given thin film region, its maximum total heat transfer rate is determined. The ratio of the conduction thermal resistance to the convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region.