A simple spray method using a plain orifice atomizer has been developed for depositing γ-aminopropyltriethoxysilane (APS) from solutions in water and in methanol onto copper surfaces. The peel strengths between copper foil and epoxy resin were measured with and without APS deposition. In all cases, a higher concentration of APS gives higher peel strength. APS applied from 1 wt% solution in methanol resulted in higher peel strength than when applied from a 1 wt% aqueous solution; the opposite was true with 0.2 wt% APS solutions, indicating a trade-off between deposited APS film thickness and surface coverage. APS was very effective when chemisorption occurred at the surface but much less effective when there was only physisorption. A study of the fracture surfaces showed that the failure is cohesive, inside the epoxy layer, and that the deposited APS on the copper surfaces had a long-range effect which was seen deep in the epoxy layer, well away from the copper surface.
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ASME 2010 International Mechanical Engineering Congress and Exposition
November 12–18, 2010
Vancouver, British Columbia, Canada
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4449-6
PROCEEDINGS PAPER
Rapid Spray Method for Improving Cu-Epoxy Interface Strength Available to Purchase
Robert C. Wetherhold,
Robert C. Wetherhold
University at Buffalo, SUNY, Buffalo, NY
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Elena Pisanova,
Elena Pisanova
Harper International, Lancaster, NY
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Hani Alarifi
Hani Alarifi
University at Buffalo, SUNY, Buffalo, NY
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Robert C. Wetherhold
University at Buffalo, SUNY, Buffalo, NY
Elena Pisanova
Harper International, Lancaster, NY
Hani Alarifi
University at Buffalo, SUNY, Buffalo, NY
Paper No:
IMECE2010-37690, pp. 169-176; 8 pages
Published Online:
April 30, 2012
Citation
Wetherhold, RC, Pisanova, E, & Alarifi, H. "Rapid Spray Method for Improving Cu-Epoxy Interface Strength." Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition. Volume 12: Processing and Engineering Applications of Novel Materials. Vancouver, British Columbia, Canada. November 12–18, 2010. pp. 169-176. ASME. https://doi.org/10.1115/IMECE2010-37690
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