Dynamic stress intensity factor is investigated theoretically on two dissimilar piezoelectric media with an interfacial crack at the edge of a circular cavity subjected to time-harmonic incident anti-plane shearing in present paper. The formulations are based on the methods of Green’s function and conjunction. Dynamic stress intensity factor at the crack’s tip are obtained by solving boundary value problems with the methods of conjunction and crack-division technique. The calculating results are plotted so as to show how the frequencies of incident wave, all kinds of physical parameters of two dissimilar piezoelectric materials, applied electric loads and geometric parameters influence on the dynamic stress intensity factor (DSIF). While some of the calculating results are compared with other published documents.
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ASME 2010 International Mechanical Engineering Congress and Exposition
November 12–18, 2010
Vancouver, British Columbia, Canada
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4445-8
PROCEEDINGS PAPER
Dynamic Stress Intensity Factor for an Interfacial Crack on a Circular Cavity in Piezoelectric Media
Tianshu Song,
Tianshu Song
Harbin Engineering University, Harbin, China
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Dong Li,
Dong Li
Harbin Engineering University, Harbin, China
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Tamman Merhej
Tamman Merhej
Harbin Engineering University, Harbin, China
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Tianshu Song
Harbin Engineering University, Harbin, China
Dong Li
Harbin Engineering University, Harbin, China
Tamman Merhej
Harbin Engineering University, Harbin, China
Paper No:
IMECE2010-37476, pp. 257-262; 6 pages
Published Online:
April 30, 2012
Citation
Song, T, Li, D, & Merhej, T. "Dynamic Stress Intensity Factor for an Interfacial Crack on a Circular Cavity in Piezoelectric Media." Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition. Volume 8: Dynamic Systems and Control, Parts A and B. Vancouver, British Columbia, Canada. November 12–18, 2010. pp. 257-262. ASME. https://doi.org/10.1115/IMECE2010-37476
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