Electrodeposition in micromolds is an important step in processes such as LIGA, an acronym from the German words for lithography, electroforming and molding, for fabricating metallic microstructures. This paper investigates electrodeposition in sacrificial polymeric micromolds with a conducting base and plastic features that provide insulating sidewalls for electrodeposition of the desired metallic micropart. Computational models for the governing transport and electrochemical phenomena are used to simulate the evolution of the electro-deposition front. The effects of the applied voltage and micromold geometry are systematically studied for their influence on the resulting electrodeposition rate and the homogeneity of the fabricated microparts. Conditions that lead to desirable process and part quality are derived from the studies.

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