In this paper, the results of a series of heat transfer experiments conducted on a compact electronics cooling device based on single phase jet impingement techniques are reported. Deionized-water is propelled into four microchannels of inner diameter 685 μm which are used as nozzles and located at a nozzle to surface distance of 2.5mm. The generated jet impingement is targeted through these channels towards the surface of a nanostructured plate. This plate of size 20mmx20mm consisted of ∼600 nm long copper nanorod arrays with an average nanorod diameter of ∼150 nm, which were integrated on top of a silicon wafer substrate coated with a copper thin film layer (i.e. Cu-nanorod/Cu-film/Silicon-wafer). Heat removal characteristics induced through jet impingement are investigated using the nanostructured plate and compared to results obtained from a flat plate of copper thin film coated on silicon wafer surface. Enhancement in heat transfer up to 15% using the nanostructured plate has been reported in this paper. Heat generated by small scale electronic devices is simulated using a thin film heater placed on an aluminum base. Surface temperatures are recorded by a data acquisition system with the thermocouples integrated on the surface at various locations. Constant heat flux provided by the film heater is delivered to the nanostructured plate placed on top of the base. Volumetric flow rate and heat flux values were varied in order to better characterize the potential enhancement in heat transfer by nanostructured surfaces.
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ASME 2010 International Mechanical Engineering Congress and Exposition
November 12–18, 2010
Vancouver, British Columbia, Canada
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4444-1
PROCEEDINGS PAPER
Submerged Jet Impingement Cooling of a Nanostructured Plate
Muhsincan Sesen,
Muhsincan Sesen
Sabanci University, Istanbul, Turkey
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Ebru Demir,
Ebru Demir
Sabanci University, Istanbul, Turkey
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Evrim Kurtoglu,
Evrim Kurtoglu
Sabanci University, Istanbul, Turkey
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Nazli Kaplan,
Nazli Kaplan
Sabanci University, Istanbul, Turkey
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Hadi Cagdas Erk,
Hadi Cagdas Erk
Sabanci University, Istanbul, Turkey
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Wisam Khudhayer,
Wisam Khudhayer
University of Arkansas at Little Rock, Little Rock, AR
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Tansel Karabacak
Tansel Karabacak
University of Arkansas at Little Rock, Little Rock, AR
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Muhsincan Sesen
Sabanci University, Istanbul, Turkey
Ali Kosar
Sabanci University, Istanbul, Turkey
Ebru Demir
Sabanci University, Istanbul, Turkey
Evrim Kurtoglu
Sabanci University, Istanbul, Turkey
Nazli Kaplan
Sabanci University, Istanbul, Turkey
Hadi Cagdas Erk
Sabanci University, Istanbul, Turkey
Wisam Khudhayer
University of Arkansas at Little Rock, Little Rock, AR
Tansel Karabacak
University of Arkansas at Little Rock, Little Rock, AR
Paper No:
IMECE2010-39055, pp. 1553-1558; 6 pages
Published Online:
April 30, 2012
Citation
Sesen, M, Kosar, A, Demir, E, Kurtoglu, E, Kaplan, N, Erk, HC, Khudhayer, W, & Karabacak, T. "Submerged Jet Impingement Cooling of a Nanostructured Plate." Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition. Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B. Vancouver, British Columbia, Canada. November 12–18, 2010. pp. 1553-1558. ASME. https://doi.org/10.1115/IMECE2010-39055
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