Thermal management of electronic products relies on the effective dissipation of heat. Heat sink elements (e.g. a pin fin) are used for any effective heat dissipation network. Despite much optimized design of the heat sink element, the heat transfer may not be effective because the interface between power device and heat sink element is critical in the heat dissipation network. Thermal Interface Materials TIM (e.g. adhesive, solder, pads, or pastes) are employed at interface between power device and heat sink element to minimize the interface thermal resistance. However, several challenges need to be addressed before they can be successfully utilized because depending on the thermal interface conditions, the thermal stress level can attain undesirable values. This issue can be addressed by the optimization of the system design with the help of simulation methods. Generally the effects of interface conditions are studied on the thermal performance of the heat sink system whereas in this paper, a coupled-field (thermal-structural) analysis using FEM is performed to study the thermal as well as structural behavior of the heat sink system. Temperature variation and stress fields in the region of interface between pin fin and base plate are analyzed. Effects of various parameters (such as contact pressure, surface roughness, TIM thickness, and operating conditions) on the resulting thermal and structural response at the interface are presented. It has been found that different interface conditions may have comparable thermal performance with significant different stress fields at the interface. Therefore stress state must be known to ensure the structural integrity of the heat sink system for a given operating condition.
Skip Nav Destination
ASME 2010 International Mechanical Engineering Congress and Exposition
November 12–18, 2010
Vancouver, British Columbia, Canada
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4428-1
PROCEEDINGS PAPER
Thermal and Structural Response of Pin Fins for Different Interface Conditions Available to Purchase
Abul Fazal M. Arif,
Abul Fazal M. Arif
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
Search for other works by this author on:
Sulaman Pashah,
Sulaman Pashah
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
Search for other works by this author on:
Syed M. Zubair,
Syed M. Zubair
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
Search for other works by this author on:
M. Inam
M. Inam
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
Search for other works by this author on:
Abul Fazal M. Arif
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
Sulaman Pashah
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
Syed M. Zubair
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
M. Inam
King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
Paper No:
IMECE2010-39972, pp. 375-384; 10 pages
Published Online:
April 30, 2012
Citation
Arif, AFM, Pashah, S, Zubair, SM, & Inam, M. "Thermal and Structural Response of Pin Fins for Different Interface Conditions." Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition. Volume 4: Electronics and Photonics. Vancouver, British Columbia, Canada. November 12–18, 2010. pp. 375-384. ASME. https://doi.org/10.1115/IMECE2010-39972
Download citation file:
10
Views
Related Proceedings Papers
Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
InterPACK2023
Experimental Characterization of a Unique Carbon Fiber Brush Heat Sink in Two-Phase Heat Transfer
IMECE2005
Related Articles
A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
J. Electron. Packag (June,2000)
Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
J. Electron. Packag (September,2002)
Thermal Interfacing Techniques for Electronic Equipment—A Perspective
J. Electron. Packag (June,2003)
Related Chapters
Outlook
Closed-Cycle Gas Turbines: Operating Experience and Future Potential
Thermal Interface Resistance
Thermal Management of Microelectronic Equipment
Reliability of Electronic Packaging
Essentials of Electronic Packaging: A Multidisciplinary Approach