In this study, the technique of immersed LEDs in ambient fluids of air, silicone oil or FC-40, respectively, to cool the LEDs which will generate large amount of heat in operation is investigated by methodologies of experimental measurements and numerical simulations. In experiments, three powers are sequentially input to the LEDs and three fluids, air, silicone oil, and FC-40, respectively, are used to cool the LEDs immersed in these fluids. Temperatures are measured by TCs and IR thermal imager. Detailed temperature and flow fields inside the lamp enclosure are analyzed, and results are compared to experimental measurements. Inclinations of LED lamp in four orientations of 0, 90, 135, 180, respectively, are studied to explore the inclination effects to thermal design of LED lamp. Simulation results found that it is not significant to the LEDs temperature responses. Thermal resistances Rja of the liquid-cooled package of LED lamp are calculated from simulation results, and it is around 13.7 °C/W in this design. In illuminance measurements, measured illuminances show tendency of reciprocal to distance square and proportional to the luminous intensity which is similar to the illuminance principle, and its values are in the sequence of 5W>4W>3W for three kinds of fluids. Basically, illuminances for air, FC-40, and silicone oil fluids are in the sequence of air>FC-40>silicone oil.
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ASME 2010 International Mechanical Engineering Congress and Exposition
November 12–18, 2010
Vancouver, British Columbia, Canada
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4428-1
PROCEEDINGS PAPER
Heat Transfer Analysis of the High-Power LED Lamp With Liquid-Cooled Package
Rong-Yuan Jou
Rong-Yuan Jou
National Formosa University, Huwei, Yunlin, Taiwan
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Rong-Yuan Jou
National Formosa University, Huwei, Yunlin, Taiwan
Paper No:
IMECE2010-37822, pp. 175-186; 12 pages
Published Online:
April 30, 2012
Citation
Jou, R. "Heat Transfer Analysis of the High-Power LED Lamp With Liquid-Cooled Package." Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition. Volume 4: Electronics and Photonics. Vancouver, British Columbia, Canada. November 12–18, 2010. pp. 175-186. ASME. https://doi.org/10.1115/IMECE2010-37822
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