This paper presents a numerical analysis of the particle critical velocity on the bonding efficiency in Cold Gas Dynamic Spray (CGDS) process by using ABAQUS/CAE 6.9-EF1. The particle impact temperature in CGDS is one of the most important factors that can determine the properties of the bonding strength to the substrate. In the CGDS process, bonding occurs when the impact velocity of particles exceed a critical velocity [1], which can reach minimum interface temperature of 60% of melting temperature in °C [2]. The critical velocity depends not only on the particle size, but also the particle material. Therefore, critical velocity should have a strong effect on the coating quality. In the present numerical analysis, impact velocities were increased in steps of 100 m/s from the lowest simulated impact velocity of 300 m/s. This study illustrates the substrate deformations and the transient impact temperature distribution between particle(s) and substrate. In this paper, an explicit numerical scheme was used to investigate the critical velocity of different sizes of particle during the bonding process. Finally, the computed results are compared with the experimental data. Copper particles (Cu) and Aluminum substrate (Al) were chosen as the materials of simulation.
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ASME 2010 International Mechanical Engineering Congress and Exposition
November 12–18, 2010
Vancouver, British Columbia, Canada
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4427-4
PROCEEDINGS PAPER
Thermal Analysis of the Particle Critical Velocity on Bonding Efficiency in Cold Gas Dynamics Spray Process
Tien-Chien Jen,
Tien-Chien Jen
University of Wisconsin-Milwaukee, Milwaukee, WI
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Sung-Cheng Wong,
Sung-Cheng Wong
University of Wisconsin-Milwaukee, Milwaukee, WI
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Yi-Hsin Yen,
Yi-Hsin Yen
University of Wisconsin-Milwaukee, Milwaukee, WI
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Qinghua Chen,
Qinghua Chen
Chongqing University, Chongqing, PR China
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Quan Liao
Quan Liao
Chongqing University, Chongqing, PR China
Search for other works by this author on:
Tien-Chien Jen
University of Wisconsin-Milwaukee, Milwaukee, WI
Sung-Cheng Wong
University of Wisconsin-Milwaukee, Milwaukee, WI
Yi-Hsin Yen
University of Wisconsin-Milwaukee, Milwaukee, WI
Qinghua Chen
Chongqing University, Chongqing, PR China
Quan Liao
Chongqing University, Chongqing, PR China
Paper No:
IMECE2010-37723, pp. 911-923; 13 pages
Published Online:
April 30, 2012
Citation
Jen, T, Wong, S, Yen, Y, Chen, Q, & Liao, Q. "Thermal Analysis of the Particle Critical Velocity on Bonding Efficiency in Cold Gas Dynamics Spray Process." Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition. Volume 3: Design and Manufacturing, Parts A and B. Vancouver, British Columbia, Canada. November 12–18, 2010. pp. 911-923. ASME. https://doi.org/10.1115/IMECE2010-37723
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