We describe new transfer method of carbon nanotube (CNT) film onto the poly-dimethysiloxane (PDMS) based on the poor adhesion between Si wafer and Au layer. To combine the CNT film with the polymer-MEMS field, it is required to transfer CNT film onto the polymer substrates. CNT film was fabricated by vacuum filtration method and was transferred onto the Au-deposited Si wafer. Using photolithography process, CNT film was patterned and PDMS is pouring and curing on the wafer. After peeling off the PDMS, patterned CNT film was transferred which was embedded into the PDMS. The possibility of embedded CNT film in the micro system was demonstrated in the application of electro-thermal actuator.

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