Aging affects both microstructure and behavior [1, 2]. Microstructural changes are driven by dislocation motion and diffusion processes. Together they affect the flow behavior in solder alloys. We address four aspects of solder microstructure and behavior as affected by aging (a) EDS studies on Ag dispersion in Sn matrix (b) a procedure for modeling intermetallic particle growth (c) a model for estimating effective viscosity of solder alloy (d) both primary and secondary creep models to predict aging effects on behavior. Solder samples were aged for different aging times (15, 30, 60, 90 days aging) and at different aging temperatures (25 C, 75 C, 125 C) prior to running creep tests. Another set of solder samples were similarly aged to characterize the microstructure. The creep data for the experiments are from a series of sixty four experiments performed using a micromechanical tester that is specially fitted with a sensitive capacitance gauge (with a resolution of 0.1 microns) to accurately measure viscoplastic responses of solder to applied loads.

This content is only available via PDF.
You do not currently have access to this content.