Heat sink assembly for a main board in a server station is built on printed circuit board by an anchor system, mounted by eutectic SnPb solder. Constant high temperature condition in the station keeps solder creeping and makes it failed eventually. To calculate the stress and predict the life of soldered anchor in the station, an FE model of anchor system is built. As viscoplastic behavior of solder depends on several factors such as microstructure of solder, temperature, load, and loading rate, model characteristics should be verified before applying it to life prediction. In this study, Anand unified constitutive equation is adapted for solder modeling and its creep behavior is calibrated and verified based on creep tests.

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