Conventional cooling techniques cannot be effectively employed in thermal management of high flux microscale to nanoscale hot spots that will occur in new generations of nanoelectronics and interconnects. Solid-state nanoscale heat pumps based on the Peltier effect have been proposed to alleviate the hot spot by producing a localized cooling effect in the vicinity of the hot spot. The proximity to the hot spot is expected to lead to efficient hot spot removal. In addition, such nanowire heat pumps may have higher coefficients of performance than their bulk materials counterparts due to enhanced thermoelectric figure of merit in optimized nanostructures. In this work nanoscale heat pumps are assumed to be assembled either parallel or perpendicular to the substrate around the hot spot with the cold junctions in contact with the hot spot and the hot junctions distributed at a constant distance from the hot spot. The objective of this work is to quantify and optimize the heat transfer rate of the nanoscale heat pump devices. An analytical model is employed to predict the heat transfer rate attainable with nanowire devices and their dependence on nanowire and hot spot dimensions, the junction temperature, and heat flux from the heat spot. Experimental efforts are on the way to demonstrate such devices.

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