The unique heat-releasing characteristics of explosively reactive nanolayers (RN) are used in this study to produce Si/solder/Si joints. The microstructure of the RN in the reacted state as well as the post-joining foil/solder interface is characterized via XRD, SEM, and TEM, which have never been done. Additionally, RN solder joints are mechanically characterized by single lap shear and nanoindentation to obtain a set of optimized processing parameters, specifically initial pressure applied (Pa) and initial temperature of the system (Ti). A maximum joint shear strength of ∼ 30MPa at Pa = 15MPa and Ti = 75°C. Furthermore, nanoindentation is used to clarify the mechanical behavior of individual layers and interfaces across the joints as a result of thermal aging.

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