Direct energy conversion between heat and electrical energy based on thermoelectric effects is attractive for potential applications in waste heat recovery and environmentally-friendly refrigeration. The energy conversion efficiency depends on the dimensionless figure of merit of thermoelectric materials, ZT, which is proportional to the electrical conductivity, the square of the Seebeck coefficient, and the inverse of the thermal conductivity. Currently, the low ZT values of available materials restrict the applications of this technology. However, significant enhancements in ZT were recently reported in nanostructured materials such as superlattices mainly due to their low thermal conductivities. According to recent studies, the reduced thermal conductivity of nanostructures is attributed to the large number of interfaces at which phonons are scattered. Based on this idea, nanocomposites are expected to have a lower thermal conductivity than their bulk counterparts with low fabrication cost just by mixing nano sized particles. In this work, we will discuss mechanisms of thermoelectric transport via modeling and provide experimental evidence on the enhancement of thermoelectric figure of merit in SiGe-based nanocomposites.
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ASME 2008 International Mechanical Engineering Congress and Exposition
October 31–November 6, 2008
Boston, Massachusetts, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4874-6
PROCEEDINGS PAPER
Thermoelectric Transport in Silicon Germanium Nanocomposite
Hohyun Lee,
Hohyun Lee
Massachusetts Institute of Technology, Cambridge, MA
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Daryoosh Vashaee,
Daryoosh Vashaee
Oklahoma State University, Tulsa, OK
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Xiaowei Wang,
Xiaowei Wang
Boston College, Chestnut Hill, MA
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Zhifeng Ren,
Zhifeng Ren
Boston College, Chestnut Hill, MA
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Sabah Bux,
Sabah Bux
University of California - Los Angeles, Los Angeles, CA
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Pawan Gogna,
Pawan Gogna
California Institute of Technology, Pasadena, CA
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Jean-Pierre Fleurial,
Jean-Pierre Fleurial
California Institute of Technology, Pasadena, CA
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Ming Y. Tang,
Ming Y. Tang
Massachusetts Institute of Technology, Cambridge, MA
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Mildred S. Dresselhaus,
Mildred S. Dresselhaus
Massachusetts Institute of Technology, Cambridge, MA
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Gang Chen
Gang Chen
Massachusetts Institute of Technology, Cambridge, MA
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Hohyun Lee
Massachusetts Institute of Technology, Cambridge, MA
Daryoosh Vashaee
Oklahoma State University, Tulsa, OK
Xiaowei Wang
Boston College, Chestnut Hill, MA
Giri Joshi
Boston College, Chestnut Hill, MA
Gaohua Zhu
Boston College, Chestnut Hill, MA
Dezhi Wang
Boston College, Chestnut Hill, MA
Zhifeng Ren
Boston College, Chestnut Hill, MA
Sabah Bux
University of California - Los Angeles, Los Angeles, CA
Pawan Gogna
California Institute of Technology, Pasadena, CA
Jean-Pierre Fleurial
California Institute of Technology, Pasadena, CA
Ming Y. Tang
Massachusetts Institute of Technology, Cambridge, MA
Mildred S. Dresselhaus
Massachusetts Institute of Technology, Cambridge, MA
Gang Chen
Massachusetts Institute of Technology, Cambridge, MA
Paper No:
IMECE2008-67436, pp. 1151-1156; 6 pages
Published Online:
August 26, 2009
Citation
Lee, H, Vashaee, D, Wang, X, Joshi, G, Zhu, G, Wang, D, Ren, Z, Bux, S, Gogna, P, Fleurial, J, Tang, MY, Dresselhaus, MS, & Chen, G. "Thermoelectric Transport in Silicon Germanium Nanocomposite." Proceedings of the ASME 2008 International Mechanical Engineering Congress and Exposition. Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B. Boston, Massachusetts, USA. October 31–November 6, 2008. pp. 1151-1156. ASME. https://doi.org/10.1115/IMECE2008-67436
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