In this paper, a brief summary of some of our recent work [1, 2] is presented, with the goal of developing an engineering science-based process-simulation capability for micro-hot-embossing of amorphous polymers. To achieve this goal: (i) a three-dimensional thermo-mechanically-coupled large deformation constitutive theory has been developed to model the temperature and rate-dependent elastic-viscoplastic response of amorphous polymers; (ii) the material parameters in the theory were calibrated by using new experimental data from a suite of simple compression tests on Zeonex-690R (cyclo-olefin polymer), that covers a wide range of temperatures and strain rates; (iii) the constitutive model was implemented in the finite element program ABAQUS/Explicit; and (iv) the predictive capability of the numerical simulation procedures were validated by comparing results from the simulation of a representative micro-hot-embossing process against corresponding results from a physical experiment.
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ASME 2008 International Mechanical Engineering Congress and Exposition
October 31–November 6, 2008
Boston, Massachusetts, USA
Conference Sponsors:
- ASME
ISBN:
978-0-7918-4874-6
PROCEEDINGS PAPER
On Modeling the Mechanical Behavior of Amorphous Polymers for the Micro-Hot-Embossing of Microfluidic Devices
Vikas Srivastava,
Vikas Srivastava
Massachusetts Institute of Technology, Cambridge, MA
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Lallit Anand
Lallit Anand
Massachusetts Institute of Technology, Cambridge, MA
Search for other works by this author on:
Vikas Srivastava
Massachusetts Institute of Technology, Cambridge, MA
Lallit Anand
Massachusetts Institute of Technology, Cambridge, MA
Paper No:
IMECE2008-67135, pp. 113-120; 8 pages
Published Online:
August 26, 2009
Citation
Srivastava, V, & Anand, L. "On Modeling the Mechanical Behavior of Amorphous Polymers for the Micro-Hot-Embossing of Microfluidic Devices." Proceedings of the ASME 2008 International Mechanical Engineering Congress and Exposition. Volume 13: Nano-Manufacturing Technology; and Micro and Nano Systems, Parts A and B. Boston, Massachusetts, USA. October 31–November 6, 2008. pp. 113-120. ASME. https://doi.org/10.1115/IMECE2008-67135
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