The past few decades have seen a number of countries around the world emerge as a growing market for high performance computers. This present study examines, in more detail, how socio-economic influences are shaping the demand function and how some computing landscapes are changing as a consequence. This study is addressing one of the key initiatives to enable 50 percent of the world’s population with access to the World Wide Web. Furthermore, this investigation is addressing the challenges for electronics packaging Engineers and Researchers. Therefore, the rational of the developed technology based on the understanding target market and usages will be given. The impact of addressing the heat dissipation and managing the use of the raw materials of the intended products are discussed. In addition, how the electronics packaging engineers can focus on developing affordable innovative technology. Finally, the impact of all of the above is examined in developing the cost effective solution from a global point of view.

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