Geometrically complex, high aspect ratio microstructures have been successfully formed in Bulk Metallic Glass (BMG) via superplastic forming against silicon dies [1–3]. Although nanoscale features have been created in a similar fashion, there exists a demand to develop these metallic nanofeatures into high aspect ratio nanostructures with controlled geometries. In past research a process model was created to predict the achievable nanoscale feature sizes and aspect ratios through a flow model [4]. The flow model assumes force equilibrium with a viscous term to account for the required force to produce flow and a capillary pressure term required to overcome surface effects which are significant at the nanoscale. In this paper, a thin film model to predict the pressure distribution across the BMG during the forming process when it is in the supercooled liquid state is presented. Silicon molds with various nanofeatures were produced using Deep Reactive Ion Etching to achieve high aspect ratio dies over a relatively large area in order to validate these models.

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