The mechanical movement in ultra-precision polishing process is an important factor which influences the polishing quality. Based on chemical-mechanical polishing (CMP) principle of PE-1 type ultra-precision polishing machine, dynamic simulation and technologic parameter optimization was studied. Firstly, a virtual prototype was built. And this prototype was validated by comparing the testing values with theoretical results. Secondly, the dynamic and kinematics characteristics of the polishing process was simulated and analyzed. Through the study of the relationship between the input velocity ratio of planetary system and workpiece movement, researcher found that the movement of workpiece is only influenced by input velocity ratio of planetary system, not involve the load of cylinder and velocity of plate. Through the simulation of point moving on workpiece surface, researcher found that the average velocity of points along the radius is increase while the radius increases, and the average velocity of points on the same circle is equal. Through the simulation of movement route, researcher found that the points along the radius have similar route style considering the same input speed ratio of planetary system. Thirdly, technologic parameter optimization was studied. The optimization research of non-uniformity revealed that the speed of plate has effect on both removal rate and the amount of material. High velocity of plate can make for getting high removing quantity. And the optimization research of material removal rate revealed that the higher pressure can get higher removal rate. At last, on the condition of same pressure and speed of plate, the optimum result is gained. The results indicated that high velocity of plate can make for getting high removing quantity, and high pressure can make for getting high removal rate.

This content is only available via PDF.
You do not currently have access to this content.