The continuing increase in integrated circuits (IC) power levels and microelectronics packaging densities has resulted in a need of materials with higher thermal conductivities and new thermal management solution designs. A base plate design that uses integrated metalized dielectric including Aluminum nitride or polycrystalline diamond (PCD) joined to a diamond/Al composite heat spreader with fins or foam attached by a single step casting is proposed. A numerical study of the design parameters is presented and analyzed. The new material and integrated bonding design can be further improved by changing the materials to a diamond/Copper base plate with polycrystalline diamond dielectric and graphitic foams for convective transport.

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