Micro electromechanical systems (MEMS) or nano electromechanical systems (NEMS) have higher surface-to-volume ratio, and hence they are susceptible to unintentional adhesion and subsequent failure to function. Although there are many classes of liquid phase anti-stiction coatings for silicon MEMS / NEMS, alkene based monolayer films with hydrogen terminated silicon coatings were chosen since this process has some important advantages over other SAM processes, such as fluorine or chlorine based films. An engineering challenge of scaling up liquid-phase anti-stiction and release processes is met by designing and fabricating a semi-automated and portable MEMS release station, which enables 20 – 40 dice or a wafer up to 100 mm in diameter to be released and coated at one time. This optimized release and coating process reduces processing time and chemical processing volume drastically compared to releasing and coating dice individually. The simultaneous processing of multiple dice was enabled through an inert FEP - Teflon dice-holder-clamp. The clamp is adaptable to hold varied sizes of dice with no lost die. The successful elimination of the secondary HF rinse for hydrogen termination has resulted in additional saving of expensive HF, additional saving of process time, and reduced exposure to the dangerous chemical - HF. The increase in hydrophobicity resulted from the optimized release and SAM coating process was confirmed through the average increase, from 68.2° to 109.3°, in water contact angle of SAM coated Si (100). The increase in the average surface roughness from 0.4 nm for source procedure to ∼ 4 nm using optimized release and SAM coating process became evident through the AFM scanned images. The increase in hydrophobicity and surface roughness using the optimized release and SAM coating process play vital roles in preventing the stiction of MEMS / NEMS devices. This scalable process has good yield and is easier to use and train personnel than a typical SAM coating process.

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