In this paper, we present our recent development of direct nanoimprinting of metal and semiconductor nanoparticles for a simple but high-throughput fabrication of micro/nanoscale structures. Nanoparticle suspension with self-assembled-monolayer (SAM) protected-nanoparticles (Au, Ag, and CdSe-ZnS core-shell quantum dots) suspended in alpha-terpineol carrier solvent are used as solutions for direct nanoimprinting. Polydimethylsiloxane (PDMS)-based soft imprinting molds with micro/nanoscale features are used. Process and material flexibility enable a very low temperature (80°C) and low pressure (5psi) nanoimprinting process and results in superfine features from micrometers down to ∼100nm resolutions. We will show the geometrical and electrical characterization of nanoimprinted structures and demonstrate working electronic components such as resistors or organic field effect transistors (OFET).
Micro/Nanoscale Structure Fabrication by Direct Nanoimprinting of Metallic and Semiconducting Nanoparticles
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Park, I, Ko, SH, Pan, H, Pisano, AP, & Grigoropoulos, CP. "Micro/Nanoscale Structure Fabrication by Direct Nanoimprinting of Metallic and Semiconducting Nanoparticles." Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 11: Micro and Nano Systems, Parts A and B. Seattle, Washington, USA. November 11–15, 2007. pp. 307-314. ASME. https://doi.org/10.1115/IMECE2007-43878
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