On-board electronics in advanced military apparatus are often subjected to severe ballistic shocks and vibrations. Safeguarding on-board electronic sensors from such transient shocks due to ballistic impact is of concern. While several studies document material characteristics of electronic boards under quasi-static and low impacts, few researchers addressed the behavior of these boards under severe impact loading. This paper presents the results of testing electronic boards under different strain rates to assess the effects of strain rates on modulus of elasticity of the boards. The results are used to suggest material models that can be used in finite element codes to accurately describe the behavior of these boards under impact loading.

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