An Advanced Real-Time Moire´ Interferometry System With Conductive Heating/Cooling and Its Application on a Creep Behavior of Solder

A new real-time moire´ interferometry system based on conductive heating and cooling is introduced. A special chamber is designed and fabricated using a high power thermoelectric cooler, which is connected to the compact moire´ interferometer to form the system. Compared with the conventional convection-based system, the proposed system provides a higher ramp rate while improving the temperature response to control signals. The system is applied to investigate the creep behavior of a eutectic solder material. A new solder joint configuration is designed and fabricated to produce a virtually uniform shear strain field. The deformation of solder joint is documented at a controlled ramp rate over several thermal cycles. The experimental results are analyzed and compared with those of finite element analyses to investigate the validity of solder constitutive models available in the literatures.