Cooling of microprocessors using flow boiling of low pressure refrigerants in multi-microchannel evaporator cooling elements is a promising technique for dissipation of footprint heat fluxes of over 300 W/cm2 while maintaining the chip safely below its maximum working temperature, providing a nearly uniform chip base temperature and minimizing energy consumption. The present invited lecture focuses on our recent experimental work and modeling of two-phase flow and boiling in single and multi-microchannels, covering: bubble dynamics, bubble coalescence, flow pattern recognition, diabatic flow pattern map, critical heat flux, hot spots, flow boiling heat transfer and two-phase pressure drops.

Volume Subject Area:
Heat Transfer, Fluid Flows, and Thermal Systems
Topics:
Cooling, Modeling, Flow (Dynamics), Boiling, Bubbles, Microchannels, Temperature, Critical heat flux, Dynamics (Mechanics), Energy consumption, Energy dissipation, Flux (Metallurgy), Heat, Heat transfer, Pattern recognition, Pressure, Pressure drop, Refrigerants, Two-phase flow
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Copyright © 2007
 by ASME
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