This paper investigates the heat transfer and pressure drop analysis of micro grooved surfaces utilized in evaporators and condensers of a two-phase flow cooling loop. These devices utilize the vapor-liquid phase change to transfer large amounts of heat, and they offer substantially higher heat flux performance with lower pumping power than most liquid cooling technologies. Microgrooved surfaces, combined with force-fed evaporation and condensation technology discussed in this paper yield high heat transfer coefficients with low pressure drops. Our most recent results, aiming to test the limits of the technology, demonstrated dissipation of almost 1kW/cm2 from silicon electronics using HFE 7100 as the working fluid. In a compact two phase system, the heat generated by the electronic components can be absorbed by microgrooved evaporators and rejected through the microgrooved surface condensers to liquid cooled slots with high heat transfer coefficients and low pressure drops on the refrigerant side. In the case of air-cooling, the same microgrooved surface heat exchanger can reject heat with a heat transfer coefficient of 3847 W/cm2 and a pressure drop of 4156 Pa. These heat transfer processes have the added capability of being combined and used together in a self-contained system cooled either by liquid or air.

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