Experimental Study on Thermal Performance of a Forced Air Cooled PBGA Package in the Compact Thin Casing: Effect of Obstacles Placed Inside the Casing

At the PC design stage, heat flow analysis in a PC is needed. However, due to the complex printed wiring board structure, a large number of grids are required to enable precise calculation, ruling out calculations using a conventional PC. This has led to attempts to predict the temperature of an actual package by calculation based on a simplified package whose result is then modified. In this study, a compact casing and a package model are used to simulate actual notebook PCs. The performance of a diode package is experimentally obtained, and the flow inside the casing and the thermal performance of the package are studied with an obstacle placed inside the casing. This study is also conducted by aiming at acquisition of benchmark test data for CFD simulations.