Transient bulk creep experiments were performed to investigate the time and temperature dependency of the bulk modulus for epoxy molding compound. These, so called pressure jump volume relaxation experiments were done by applying positive and negative pressure jumps followed by a holding period at those pressure levels and the whole set of experiment was repeated at different temperatures. The observations are in the pressure range of 10 to 50 MPa and temperature range of 50 to 150° C. For negative pressure jumps (or expansion experiments) the bulk modulus was found to be almost independent of time. For positive pressure jumps (or compression experiments) time dependent volume decreases very slow. Compared to time and pressure, temperature dependency was of highest influence. A mathematical model has been proposed for the observed temperature and pressure dependency of the bulk modulus.
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ASME 2007 International Mechanical Engineering Congress and Exposition
November 11–15, 2007
Seattle, Washington, USA
Conference Sponsors:
- ASME
ISBN:
0-7918-4299-1
PROCEEDINGS PAPER
Study of Time and Temperature Dependency of Bulk Modulus for Molding Compound by Transient Bulk Creep Experiments Available to Purchase
M. D. Patel,
M. D. Patel
Delft University of Technology, Delft, The Netherlands
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K. M. B. Jansen,
K. M. B. Jansen
Delft University of Technology, Delft, The Netherlands
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L. J. Ernst,
L. J. Ernst
Delft University of Technology, Delft, The Netherlands
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C. Bohm
C. Bohm
Infineon Technologies, Munich, Germany
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M. D. Patel
Delft University of Technology, Delft, The Netherlands
K. M. B. Jansen
Delft University of Technology, Delft, The Netherlands
L. J. Ernst
Delft University of Technology, Delft, The Netherlands
J. Zhou
Lamar University, Beaumont, TX
C. Bohm
Infineon Technologies, Munich, Germany
Paper No:
IMECE2007-42852, pp. 275-279; 5 pages
Published Online:
May 22, 2009
Citation
Patel, MD, Jansen, KMB, Ernst, LJ, Zhou, J, & Bohm, C. "Study of Time and Temperature Dependency of Bulk Modulus for Molding Compound by Transient Bulk Creep Experiments." Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 5: Electronics and Photonics. Seattle, Washington, USA. November 11–15, 2007. pp. 275-279. ASME. https://doi.org/10.1115/IMECE2007-42852
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