The objective of this paper is to develop an analytical or mathematical predicative model for the evaluation of dynamic response of a structural element in a microelectronic or an optoelectronic product to an impact load occurring as a result of drop or shock test. Closed-form theoretical solution was obtained to simulate the board level drop test. The block diagram based SIMULINK analysis was introduced to determine the response with various impact configurations for the system level drop test as well. This study will help reliability engineers to design the impact input profiles and obtain the desired responses, and to calibrate and validate finite element analysis results quickly for both board level and system level drop test. It was found that time durations of the input profiles play an important role in the dynamic response. The system response can be designed by carefully choosing the impact time duration. Certain input pulse time results in the response with very low ringing after first or second peaks.
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ASME 2007 International Mechanical Engineering Congress and Exposition
November 11–15, 2007
Seattle, Washington, USA
Conference Sponsors:
- ASME
ISBN:
0-7918-4299-1
PROCEEDINGS PAPER
Analysis on the Effect of Input Impact Profiles in Drop Test Available to Purchase
Ratna P. Niraula,
Ratna P. Niraula
Lamar University, Beaumont, TX
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Kendrick Aung
Kendrick Aung
Lamar University, Beaumont, TX
Search for other works by this author on:
Jiang Zhou
Lamar University, Beaumont, TX
Ratna P. Niraula
Lamar University, Beaumont, TX
Kendrick Aung
Lamar University, Beaumont, TX
Paper No:
IMECE2007-41138, pp. 223-231; 9 pages
Published Online:
May 22, 2009
Citation
Zhou, J, Niraula, RP, & Aung, K. "Analysis on the Effect of Input Impact Profiles in Drop Test." Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 5: Electronics and Photonics. Seattle, Washington, USA. November 11–15, 2007. pp. 223-231. ASME. https://doi.org/10.1115/IMECE2007-41138
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