This study focuses on microelectronic package design for the oil and natural gas drilling of wells with depths in excess of 20,000 ft, where package temperatures can exceed 204°C. At these high temperatures, solder interconnect sites are subject to fatigue and creep failures due to the stress generated by the thermal expansion mismatch between various components in the package. Typically this phenomenon is modeled by finite element analysis (FEA) to predict the number of cycles to failure. To ensure meaningful model results, however, accurate time and temperature-dependent mechanical properties are needed. This study examines five solders suitable for high temperature: 90Pb-10Sn, 95Sn-5Sb, 92.5Pb-5Sn-2.5Ag, 95Pb-5In, and 93Pb-3Sn-2Ag-2In. Uniaxial tension tests of the solder wires are carried out on a MTS servohydraulic machine using wedge grips. To evaluate the time-dependence on deformation, a strain rate study was carried out at 0.5%/sec, 1%/sec, and 5%/sec. Nanoindentation of solder wire is performed and compared to the corresponding solder wires tested through uniaxial tension tests. Dynamic nanoindentation through continuous stiffness measurement is performed on the wires to obtain the indentation data less sensitive to creep of the material, as well as to assess the effect of indentation depth on elastic modulus for each solder. One purpose of nanoindentation testing is to determine its suitability for the mechanical testing of soft solders. Mechanical properties obtained from these tests will be used in future modeling studies to estimate the cyclic fatigue life of these solders under thermal loading.
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ASME 2007 International Mechanical Engineering Congress and Exposition
November 11–15, 2007
Seattle, Washington, USA
Conference Sponsors:
- ASME
ISBN:
0-7918-4299-1
PROCEEDINGS PAPER
Constitutive Relations of High Temperature Solders Available to Purchase
Harry Schoeller,
Harry Schoeller
State University of New York at Binghamton, Binghamton, NY
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Shubhra Bansal,
Shubhra Bansal
GE Global Research, Niskayuna, NY
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Aaron Knobloch,
Aaron Knobloch
GE Global Research, Niskayuna, NY
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David Shaddock,
David Shaddock
GE Global Research, Niskayuna, NY
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Junghyun Cho
Junghyun Cho
State University of New York at Binghamton, Binghamton, NY
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Harry Schoeller
State University of New York at Binghamton, Binghamton, NY
Shubhra Bansal
GE Global Research, Niskayuna, NY
Aaron Knobloch
GE Global Research, Niskayuna, NY
David Shaddock
GE Global Research, Niskayuna, NY
Junghyun Cho
State University of New York at Binghamton, Binghamton, NY
Paper No:
IMECE2007-42215, pp. 201-208; 8 pages
Published Online:
May 22, 2009
Citation
Schoeller, H, Bansal, S, Knobloch, A, Shaddock, D, & Cho, J. "Constitutive Relations of High Temperature Solders." Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 5: Electronics and Photonics. Seattle, Washington, USA. November 11–15, 2007. pp. 201-208. ASME. https://doi.org/10.1115/IMECE2007-42215
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