A novel means for 3-D microfabrication is proposed. First, a process for generating metal patterns on the outer surface of a CCFL (Cold Cathode Fluorescent Lamp) was developed. The CCFL with the integrated mask was then used as an exposure source for subsequent lithography process to achieve the pattern transfer on the inner surface of a Cu tube. After wet etch, various grooves were successfully fabricated onto the inner surface of the Cu tube with a 2.47mm inner diameter. By the proposed method, the minimum achievable line-width could be less than 20μm. Compared with traditional manufacturing methods, the proposed approach could improve the machining precision and roughness, reduce the manufacturing difficulties, and lower the manufacturing cost substantially.
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ASME 2007 International Mechanical Engineering Congress and Exposition
November 11–15, 2007
Seattle, Washington, USA
Conference Sponsors:
- ASME
ISBN:
0-7918-4297-5
PROCEEDINGS PAPER
3-D Lithography by CCFL Exposure
Zong-Ting Yuan,
Zong-Ting Yuan
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
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Cheng-Chang Lee,
Cheng-Chang Lee
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
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Horng-Jou Wang,
Horng-Jou Wang
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
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Heng-Chung Chang,
Heng-Chung Chang
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
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Huang-Kun Chen,
Huang-Kun Chen
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
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Tai-Kang Shing
Tai-Kang Shing
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
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Zong-Ting Yuan
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
Cheng-Chang Lee
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
Horng-Jou Wang
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
Heng-Chung Chang
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
Huang-Kun Chen
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
Tai-Kang Shing
Delta Electronics Corporation, Taoyuan Hsien, Taiwan, R.O.C.
Paper No:
IMECE2007-41733, pp. 393-397; 5 pages
Published Online:
May 22, 2009
Citation
Yuan, Z, Lee, C, Wang, H, Chang, H, Chen, H, & Shing, T. "3-D Lithography by CCFL Exposure." Proceedings of the ASME 2007 International Mechanical Engineering Congress and Exposition. Volume 3: Design and Manufacturing. Seattle, Washington, USA. November 11–15, 2007. pp. 393-397. ASME. https://doi.org/10.1115/IMECE2007-41733
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