The pressure drop and heat transfer characteristics of a single-phase micro-pin-fin heat sink were investigated experimentally. Fabricated from 110 copper, the heat sink consisted of 1950 staggered micro-pins with 200×200 μm2 cross-section by 670 μm height. Deionized water was employed as the cooling liquid. A coolant inlet temperature of 25°C, and two heat flux levels, q" eff = 50 W/cm2 and q" eff = 100 W/cm2, defined relative to the planform area of the heat sink, were tested. The inlet Reynolds number ranged from 93 to 634 for q" eff = 50 W/cm2, and 127 to 634 for q" eff = 100 W/cm2. The measured pressure drop and temperature distribution were used to evaluate average friction factor and local averaged heat transfer coefficient/Nusselt number. Predictions of the Moores and Joshi friction factor correlation and the Chyu et al. heat transfer correlation that were developed using macro-size pin-fin arrays were compared to micro-pin-fin heat sink data. While the Moores and Joshi correlation provide acceptable predictions, the Chyu et al. correlation overpredicted local Nusselt number data by a fairly large margin. These findings point to the need for further study of single-phase thermal/fluid transport process in micro-pin-fin heat sinks.
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ASME 2006 International Mechanical Engineering Congress and
Exposition
November 5–10, 2006
Chicago, Illinois, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-4786-1
PROCEEDINGS PAPER
Pressure Drop and Heat Transfer in a Single-Phase Micro-Pin-Fin Heat Sink Available to Purchase
Abel M. Siu Ho,
Abel M. Siu Ho
University of Hawaii at Manoa
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Frank Pfefferkorn
Frank Pfefferkorn
University of Wisconsin at Madison
Search for other works by this author on:
Abel M. Siu Ho
University of Hawaii at Manoa
Weilin Qu
University of Hawaii at Manoa
Frank Pfefferkorn
University of Wisconsin at Madison
Paper No:
IMECE2006-14777, pp. 213-220; 8 pages
Published Online:
December 14, 2007
Citation
Ho, AMS, Qu, W, & Pfefferkorn, F. "Pressure Drop and Heat Transfer in a Single-Phase Micro-Pin-Fin Heat Sink." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 3. Chicago, Illinois, USA. November 5–10, 2006. pp. 213-220. ASME. https://doi.org/10.1115/IMECE2006-14777
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