Proper design of thermal management solutions for future nano-scale electronics or photonics will require knowledge of flow and transport through micron-scale ducts. As in the macro-scale conventional counterparts, such micron-scale flow systems would require robust simulation tools for early-stage design iterations. This paper concentrates on such a flow process, namely pressure-driven gas flow over a backward facing step in a microchannel. A well-known particle-based method, Direct Simulation Monte Carlo (DSMC) is used as the simulation tool. Separating the macroscopic velocity from the molecular velocity through the use of the Information Preservation (IP) method eliminates the high-level of statistical noise as typical in DSMC calculations of low-speed flows. The non-isothermal IP method is further modified to incorporate the pressure boundary conditions, which are expected to be more prevalent in design of thermal management systems. The applicability of the method in solving a real flow situation is verified using the backward facing step flow in a micro geometry. The flow and heat transfer mechanisms at different pressures in Knudsen transient regime are investigated. The range of parameters for this investigation are: Re from 0.03 to 0.64, Ma from 0.013 to 0.083, and Kn from 0.24 to 4.81, all based on maximum values.
Skip Nav Destination
ASME 2006 International Mechanical Engineering Congress and
Exposition
November 5–10, 2006
Chicago, Illinois, USA
Conference Sponsors:
- Microelectromechanical Systems Division
ISBN:
0-7918-4775-6
PROCEEDINGS PAPER
Simulation of Low Speed Gas Flow Over Backward Facing Step in Microchannels Available to Purchase
Jayanta S. Kapat
Jayanta S. Kapat
University of Central Florida
Search for other works by this author on:
Umit Kursun
University of Central Florida
Jayanta S. Kapat
University of Central Florida
Paper No:
IMECE2006-14957, pp. 625-632; 8 pages
Published Online:
December 14, 2007
Citation
Kursun, U, & Kapat, JS. "Simulation of Low Speed Gas Flow Over Backward Facing Step in Microchannels." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Microelectromechanical Systems. Chicago, Illinois, USA. November 5–10, 2006. pp. 625-632. ASME. https://doi.org/10.1115/IMECE2006-14957
Download citation file:
14
Views
Related Proceedings Papers
Related Articles
Two Constructal Routes to Minimal Heat Flow Resistance via Greater Internal Complexity
J. Heat Transfer (February,1999)
The UGKS Simulation of Microchannel Gas Flow and Heat Transfer Confined Between Isothermal and Nonisothermal Parallel Plates
J. Heat Transfer (December,2020)
Using Direct Simulation Monte Carlo With Improved Boundary Conditions for Heat and Mass Transfer in Microchannels
J. Heat Transfer (April,2010)
Related Chapters
Completing the Picture
Air Engines: The History, Science, and Reality of the Perfect Engine
Fans and Air Handling Systems
Thermal Management of Telecommunications Equipment
Introduction
Thermal Management of Microelectronic Equipment