For connecting polymeric, modular microfluidic devices, precise, passive alignment structures can prevent infinitesimal motions between the devices and minimize misalignment of the devices. The motion and constraint of passive alignment structures were analyzed for the design of assembly features using screw theory. A combination of three v-groove and sphere joints constrained all degrees of freedom of the two mating plates without over-constraint. To validate the designed passive alignment scheme, hot embossing experiments were conducted using a micromilled brass mold insert, containing alignment features. Prototype alignment structures have dimensional variation. The alignment accuracy of the stacked polymeric plates was estimated by the mismatches between alignment marks of two plates. The mismatches ranged from 28 μm to 70 μm.
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ASME 2006 International Mechanical Engineering Congress and
Exposition
November 5–10, 2006
Chicago, Illinois, USA
Conference Sponsors:
- Microelectromechanical Systems Division
ISBN:
0-7918-4775-6
PROCEEDINGS PAPER
Passive Alignment Structures in Modular, Polymer Microfluidic Devices
Byoung Hee You,
Byoung Hee You
LouisiBaton Rouge, LAana State University
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Dimitris E. Nikitopoulos,
Dimitris E. Nikitopoulos
Louisiana State University
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Steven A. Soper,
Steven A. Soper
Louisiana State University
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Michael C. Murphy
Michael C. Murphy
Louisiana State University
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Byoung Hee You
LouisiBaton Rouge, LAana State University
Pin-Chuan Chen
Louisiana State University
Jason Guy
Louisiana State University
Proyga Datta
Louisiana State University
Dimitris E. Nikitopoulos
Louisiana State University
Steven A. Soper
Louisiana State University
Michael C. Murphy
Louisiana State University
Paper No:
IMECE2006-16100, pp. 51-56; 6 pages
Published Online:
December 14, 2007
Citation
You, BH, Chen, P, Guy, J, Datta, P, Nikitopoulos, DE, Soper, SA, & Murphy, MC. "Passive Alignment Structures in Modular, Polymer Microfluidic Devices." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Microelectromechanical Systems. Chicago, Illinois, USA. November 5–10, 2006. pp. 51-56. ASME. https://doi.org/10.1115/IMECE2006-16100
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