Platinum microelectrodes become essential components in microfluidic devices for separation, pumping, sensing, and other bio-analyses. Due to their chemical inertness, several research groups have developed microfluidic devices with integrated platinum electrodes on silicon, quartz, or glass substrates. However, no techniques have been reported so far for depositing platinum electrodes in polymeric microchannels. In this study, a novel fabrication scheme for forming integrated microelectrodes in a poly-dimethyl-siloxane (PDMS) microchip is described. The electrode fabrication technique consists of photolithography, thermal processing, sequential sputtering of titanium and platinum and stripping off photoresist, while soft-lithography is used to form the microfluidic channels on PDMS. This approach facilitates precise positioning of the electrodes with a micron-sized gap between them, and it can be used for both low and high aspect ratio channels. The platinum electrodes, formed on the PDMS channel surface, demonstrated very good interfacial adhesion with the substrate due to the use of a very thin titanium layer between the platinum and PDMS. The surface roughness of the electrodes was found around ±50 nm.
Skip Nav Destination
ASME 2006 International Mechanical Engineering Congress and
Exposition
November 5–10, 2006
Chicago, Illinois, USA
Conference Sponsors:
- Microelectromechanical Systems Division
ISBN:
0-7918-4775-6
PROCEEDINGS PAPER
Platinum Microelectrodes in Polymeric Microfluidic Chips: A New Fabrication Approach
Prashanta Dutta
Prashanta Dutta
Washington State University
Search for other works by this author on:
Nazmul Huda
Washington State University
Prashanta Dutta
Washington State University
Paper No:
IMECE2006-14066, pp. 175-179; 5 pages
Published Online:
December 14, 2007
Citation
Huda, N, & Dutta, P. "Platinum Microelectrodes in Polymeric Microfluidic Chips: A New Fabrication Approach." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Microelectromechanical Systems. Chicago, Illinois, USA. November 5–10, 2006. pp. 175-179. ASME. https://doi.org/10.1115/IMECE2006-14066
Download citation file:
9
Views
Related Proceedings Papers
Related Articles
PCR Microchip Array Based on Polymer Bonding Technique
J. Electron. Packag (March,2005)
Scratching Test of Hard-Brittle Materials Under High Hydrostatic Pressure
J. Manuf. Sci. Eng (May,2001)
Fabrication of Micro Single Chamber Solid Oxide Fuel Cell Using Photolithography and Pulsed Laser Deposition
J. Fuel Cell Sci. Technol (April,2015)
Related Chapters
Insulating Properties of W-Doped Ga2O3 Films Grown on Si Substrate for Low-K Applications
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)
Component and Printed Circuit Board
Thermal Management of Microelectronic Equipment, Second Edition
Component and Printed Circuit Board
Thermal Management of Telecommunications Equipment