The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.

1.
Ye, H., 2004, Mechanical Behavior of Microelectronics and Power Electronics Solder Joints under High Current Density: Analytical Modeling and Experimental Investigation. Ph.D Thesis: State University of New York at Buffalo, 297 pages.
2.
Huang
A. T.
,
Gusak
A. M.
,
Tu
K. N.
, and
Lai
Y.-S.
,
2006
, “
Thermomigration in SnPb Composite Flip Chip Solder Joints
”,
Applied Physics Letters
,
88
(
14)
: pp.
141911
3
.
3.
Ye
H.
,
Basaran
C.
and
Hopkins
D.
,
2003
, “
Thermomigration in Pb-Sn Solder Joints under Joule Heating During Electric Current Stressing
”,
Applied Physics Letters
,
82
(
7)
: pp.
1045
1047
.
4.
Roush, W. and Jaspal, J., 1982, “Thermomigration in Lead-Indium Solder”, in Electronic Components Conference, San Diego, CA, 32: pp. 342–345.
5.
Ahat
S.
,
Sheng
M.
and
Luo
L.
,
2001
, “
Effects of Static Thermal Aging and Thermal Cycling on the Microstructure and Shear Strength of Sn95.5Ag3.8Cu0.7 Solder Joints
”,
Journal of Materials Research
,
16
(
10)
: pp.
2914
2921
.
6.
Chaung
C.-M.
and
Lin
K.-L.
,
2003
, “
Effect of Microelements Addition on the Interfacial Reaction between Sn-Ag-Cu Solders and the Cu Substrate
”,
Journal of Electronic Materials
,
32
(
12)
: pp.
1426
1431
.
7.
Deng
X.
,
Piotrowski
G.
,
Williams
J. J.
, and
Chawla
N.
,
2003
, “
Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution During Thermal Aging of Sn-Ag Solder/Cu Joints
”,
Journal of Electronic Materials
,
32
(
12)
: pp.
1403
1413
.
8.
Terashima
S.
,
Kariya
Y.
,
Hosoi
T.
, and
Tanaka
M.
,
2003
, “
Effect of Silver Content on Thermal Fatigue Life of Sn-xAg- 0.5Cu Flip-Chip Interconnects
”,
Journal of Electronic Materials
,
32
(
12)
: pp.
1527
1533
.
9.
Yoon
J.-W.
,
Lee
Y.-H.
, et al.,
2004
, “
Intermetallic Compound Layer Growth at the Interface between Sn-Cu-Ni Solder and Cu Substrate
”,
Journal of Alloys and Compounds
,
381
(
1–2)
: pp.
151
157
.
10.
Lee
T. Y.
,
Choi
W. J.
, et al.,
2002
, “
Morphology, Kinetics, and Thermodynamics of Solid-State Aging of Eutectic SnPb and Pb-Free Solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn- 0.7Cu) on Cu
”,
Journal of Materials Research
,
17
(
2)
: pp.
291
301
.
11.
Tu
K. N.
and
Thompson
R. D.
,
1982
, “
Kinetics of Interfacial Reaction in Bimetallic Cu-Sn Thin Films
”,
Acta Metallurgica
,
30
(
5)
: pp.
947
952
.
12.
Zeng
K.
,
Stierman
R.
, et al.,
2005
, “
Kirkendall Void Formation in Eutectic SnPb Solder Joints on Bare Cu and Its Effect on Joint Reliability
”,
Journal of Applied Physics
,
97
(
2)
: pp.
024508
8
.
13.
Tu
K. N.
,
1973
, “
Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films
”,
Acta Metallurgica
,
21
(
4)
: pp.
347
354
.
14.
Schroerschwarz
R.
and
Heitkamp
D.
,
1971
, “
Thermotransport of Substitutional Impurities in Copper
”,
Physica Status Solidi (B)
,
45
(
1)
: pp.
273
86
.
15.
Kirchheim
R.
,
1992
, “
Stress and Electromigration in Al-Lines of Integrated Circuits
”,
Acta Metallurgica et Materialia
,
40
(
2)
: pp.
309
323
.
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