The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.
- Electronic and Photonic Packaging Division
Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints
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Abdulhamid, MF, Basaran, C, & Hopkins, DC. "Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Chicago, Illinois, USA. November 5–10, 2006. pp. 53-57. ASME. https://doi.org/10.1115/IMECE2006-13119
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