This study describes a wafer bonding technique using CYTOP™ inking method for the high volume packaging of micro-electro mechanical system (MEMS) devices. CYTOP™ is a class of perfluoro (alkenyl vinyl ether) polymer which is obtained by cyclopolymerization of perfluoro. The CYTOP™ adhesive bonding requires much lower temperature (150 to 200° C) compared to other bonding techniques such as soldering (> 250° C) or anodic (~350° C) bonding. The lower temperatures involved in the process reduce the risk of thermal damage to temperature sensitive devices during packaging. The described bonding process consists of a wet inking technique in which wet CYTOP™ ink is applied on soft cured CYTOP™ before bonding. In this study, CYTOP™ is characterized for its bonding strength and quality. The experiments are performed on silicon and glass wafer substrates. The bonded samples are pull-tested and tensile stress values are recorded at the instance of bond failure. About 90% of the samples failed at the bonding interface which indicates that the recorded stress values are the bond strength of CYTOP™. The bond strength of CYTOP™ depends upon the curing temperature and the curing time. The highest bond strength of 16. 46 MPa is recorded at 200° C and 45 min. of curing. The CYTOP™ bond strength at 200° C is comparable with bond strength of BCB at 250° C.
- Electronic and Photonic Packaging Division
Adhesive Strength Characterization of CYTOP™: Low Temperature Wafer-Level Packaging
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Patil, V, & O'Neal, CB. "Adhesive Strength Characterization of CYTOP™: Low Temperature Wafer-Level Packaging." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Chicago, Illinois, USA. November 5–10, 2006. pp. 335-339. ASME. https://doi.org/10.1115/IMECE2006-14791
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