Many factors such as high intensity current, thermal load, shock load, vibration load and etc., can induce the failure in electronic equipment. It is common for electronic equipment to be subjected to a combination of the loads mentioned above simultaneously. In this paper, qualitative finite element simulations of thermomigration induced strain fields in lead free solders are conducted using a fully coupled displacement-diffusion model  with nonlinear mechanical material properties. The solutions are discussed and compared to experimental data as well as theoretical developments from literature.
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Thermomigration Induced Strain Field Simulation for Microelectronic Lead Free Solder Joints
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Li, S, Lin, M, Abdulhamid, MF, & Basaran, C. "Thermomigration Induced Strain Field Simulation for Microelectronic Lead Free Solder Joints." Proceedings of the ASME 2006 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Chicago, Illinois, USA. November 5–10, 2006. pp. 235-239. ASME. https://doi.org/10.1115/IMECE2006-13046
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