Many factors such as high intensity current, thermal load, shock load, vibration load and etc., can induce the failure in electronic equipment. It is common for electronic equipment to be subjected to a combination of the loads mentioned above simultaneously. In this paper, qualitative finite element simulations of thermomigration induced strain fields in lead free solders are conducted using a fully coupled displacement-diffusion model [1] with nonlinear mechanical material properties. The solutions are discussed and compared to experimental data as well as theoretical developments from literature.

1.
Basaran
C.
,
Lin
M.
, and
Ye
H
,
2003
, “
A Thermodynamic Model for Electrical Current Induced Damage
”,
International Journal of Solids and Structures
,
40
: pp.
7315
7327
.
2.
Platten
J. K.
,
2006
, “
The Soret Effect: A Review of Recent Experimental Results
,
Journal of Applied Mechanics-Transactions of the Asme
,
73
(
1)
: pp.
5
15
.
3.
Ludwig
C.
,
1856
, “
Diffusion Zwichen Unfleigh Erwarmten Orten Gleich Zusammengesetz Losungen
”,
Sitzungsber. Kaiser. Akad. Wiss. (Mathem.-Naturwiss. Cl.), Wien
,
65
(
k1)
: pp.
539
539
.
4.
Ru
C. Q.
,
2000
, “
Thermomigration as a Driving Force for Instability of Electromigration Induced Mass Transport in Interconnect Lines
”,
Journal of Materials Science
,
35
(
22)
: pp.
5575
5579
.
5.
Bastawros
A.-F. K., K-S
,
1998
, “
Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
”,
Journal of Electronic Packaging, Transactions of the ASME
,
120
(
4)
: pp.
354
359
.
6.
Lin
M. H.
and
Basaran
C.
,
2005
, “
Electromigration Induced Stress Analysis Using Fully Coupled Mechanical-Diffusion Equations with Nonlinear Material Properties
”,
Computational Materials Science
,
34
(
1)
: pp.
82
98
.
7.
Sarychev
M. E.
,
Yu
V. Z.
, et al.,
1999
, “
General Model for Mechanical Stress Evolution During Electromigration
”,
Journal of Applied Physics
,
86
(
6)
: pp.
3068
3075
.
This content is only available via PDF.
You do not currently have access to this content.