Au/Sn eutectic solder alloy is particularly attractive for high-power electronics and optoelectronics packaging as hermetic sealing and die attachment material. The robustness and reliability of solder joint are essential to meet the global demand for longer operating lifetime in their applications. The mechanical response of Au/Sn solder alloy is studied using nanoindentation (Nano-Test 600). Miniature creep samples were created using a specially designed fixture and static loading creep tests were carried out on these solder samples at temperatures of 25°C, 75°C and 125°C using tensile testing machine (Micro-Testing System). The Young's Modulus and hardness of 80Au/20Sn solder alloy increase with an increase in load rate or a decrease in temperature. The microstructure and creep rupture fractography of 80Au/20Sn solder alloy have been observed and analysed.
Volume Subject Area:
Electronic and Photonic Packaging
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