This paper presents the design, fabrication, and characterization of unique piezoresistive microfabricated shear stress sensors for direct measurements of shear stress underwater. The uniqueness of this design is in its transduction scheme which uses sidewall-implanted piezoresistors to measure lateral force (and shear stress), along with traditional top-implanted piezoresistors to detect normal forces. Aside from the oblique-implant technique, the fabrication process also includes hydrogen anneal step to smooth scalloped silicon sidewalls due to Deep Reactive Ion Etch process, which was shown to reduce 1/f noise level by almost an order of magnitude for the sidewall-implanted piezoresistors. Lateral sensitivity characterization of the sensors was done using a microfabricated silicon cantilever force sensor, while out-of-plane characterization was done using Laser Doppler Vibrometry technique. In-plane sensitivity and out-of-plane crosstalk were characterized, as well as hysteresis and repeatability of the measurements. The sensors are designed to be used underwater for various applications.

1.
Padmanabhan, A., et al Micromachined sensors for static and dynamic shear-stress measurements in aerodynamic flows. in Solid State Sensors and Actuators, 1997. TRANSDUCERS ’97 Chicago., 1997 International Conference on. 1997.
2.
Liu
 
C.
, et al.,
A micromachined flow shear-stress sensor based on thermal transfer principles
.
Journal of Microelectromechanical Systems
,
1999
.
8
(
1
): p.
90
99
.
3.
Huang
 
J.-B.
, el al.,
Improved micro thermal shear-stress sensor
.
Instrumentation and Measurement, IEEE Transactions on
,
1996
,
45
(
2
): p.
570
574
.
4.
Jiang, F., et al. Flexible shear stress sensor skin for aerodynamics applications. in Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on. 2000.
5.
Schmidt
 
M. A.
, et al.,
Design and calibration of a microfabricated floating-element shear-stress sensor
.
Electron Devices, IEEE, Transactions on
,
1988
.
35
(
6
): p.
750
757
.
6.
Zhe
 
J.
,
Modi
 
V.
, and
Farmer
 
K. R.
,
A microfabricated wall shear-stress sensor with capacitative sensing
.
Journal of Microelectromechanical Systems
,
2005
.
14
(
1
): p.
167
175
.
7.
Horowitz, S., et al. A Wafer-Bonded, Floating Element Shear-Stress Sensor Using a Geometric Moire Optical Transduction Technique, in Solid-State Sensor, Actuator and Microsystems Workshop. 2004. Hilton Head Island, South Carolina, USA.
8.
Naughton
 
J. W.
and
Sheplak
 
M.
,
Modern developments in shear-stress measurement
.
Progress in Aerospace Sciences
,
2002
.
38
: p.
515
570
.
9.
Xu, Y., et al. Underwater shear-stress sensor. in Micro Electro Mechanical Systems, 2002. The Fifteenth IEEE International Conference on. 2002.
10.
Chui, B.W., et al. Sidewall-implanted dual-axis piezoresistive cantilever for AFM data storage readback and tracking. in Micro Electro Mechanical Systems, 1998 MEMS 98. Proceedings., The Eleventh Annual International Workshop on. 1998.
11.
Kanda
 
Y.
,
A Graphical Representation of the Piezoresistance Coefficients in Silicon
.
IEEE Transactions on Electron Devices
,
1982
.
29
(
1
): p.
64
70
.
12.
Allen
 
J. M.
,
Improved Sensing Element for Skin-Friction Balance Measurements
.
AIAA
,
1980
.
18
: p.
1342
1345
.
13.
Haritonidis, J. H., Advances in Fluid Mechanics Measurements. 1989. p. 229–261.
14.
Lee, M.-C.M., J. Yao, and M.C. Wu. Silicon Profile Transformation and Sidewall Roughness Reduction Using Hydrogen Annealing. in IEEE International Conference on MEMS. 2005. Miami, FL, USA.
15.
Pruitt
 
B. L.
and
Kenny
 
T. W.
,
Piezoresistive Cantilevers and Measurement System for Low Force Electrical Contact Measurements
.
Sensors and Actuators A
,
2003
.
104
(
1
): p.
68
77
.
16.
Pruitt
 
B. L.
,
Park
 
W.-T.
, and
Kenny
 
T. W.
,
Measurement system for low force and small displacement contacts
.
Journal of Microelectromechanical Systems
,
2004
.
13
(
2
): p.
220
229
.
17.
Partridge, A., Lateral Piezoresistive Accelerometer With Epipoly Encapsulation, Ph.D. thesis in Electrical Engineering. 2003. Stanford University: Stanford, p. 143.
This content is only available via PDF.
You do not currently have access to this content.